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Corrugated - Joe Dieffenbacher Engineering Memorial Scholarship
Award amount
$5k
Deadline
Mon, Jun 15, 2026
Time to apply
30–60 min
Provider
Corrugated Packaging Council of TAPPI
Eligibility
- No specific grade point average is required
- Working full time or part time in the corrugated industry and attending day/night school for a graduate or undergraduate degree OR be a full time student in a two-year or a four-year college, university or technical school
- Demonstrate an interest in the corrugated packaging industry related to maintenance or engineering (part time employment or internships in the corrugated industry are looked upon in a very favorable manner)
- Selection of the scholarship winners will be based on the scholarship committee’s opinion of overall maturity, job potential and the candidates’ future contribution potential to the corrugated industry
Description
The purpose of the TAPPI Scholarship Program is to recognize academic excellence, increase awareness and participation in TAPPI’s member groups and to attract talented individuals to the industry segments that TAPPI serves. The Joe Dieffenbacher Engineering Memorial Scholarship fund ($5,000) has been established by the Corrugated Packaging Council of TAPPI to be awarded to a student interested in entering the engineering area of the corrugated industry.
Provided by Corrugated Packaging Council of TAPPI
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You’ll be taken to the official application site. Verify deadlines and requirements there.
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